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MEMS Packaging [electronic resource] / T. Hsu (ed.)
Stevenage IET 2004
book jacket
Location Call Number Status
 Electronic Book  WEB LINK    AVAIL. VIA WEB
Subject(s) Aerospace engineering
Design
Electronic packaging
Microfabrication
Micromechanics
Sealing (Technology)
Telecommunication
Physical Description 305
Summary The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aerospace application
Series Circuits, Devices and Systems

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