Mardigian Library
Ask a QuestionMy Library Account
Search Library Catalog - Books, DVDs & More
Limit to available
More Searches
Limit results to available items
Find more results:
Search MelCat
More Information
Silicon Wafer Bonding Technology for VLSI and MEMS Applications [electronic resource] / S. Iyer (ed.)
Stevenage IET 2002
book jacket
Location Call Number Status
 Electronic Book  WEB LINK    AVAIL. VIA WEB
Subject(s) Electric resistance
Grinding and polishing
Integrated circuits -- Very large scale integration
Semiconductor wafers
Silicon-on-insulator technology
Physical Description 175
Summary The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process
Series Circuits, Devices and Systems

Mardigian Library, 4901 Evergreen Rd.
Dearborn, MI 48128-1491 313-593-5400 fax 313-593-5561
The Regents of the University of Michigan | Non-Discrimination Policy
Copyright © The University of Michigan - Dearborn • 4901 Evergreen Road • Dearborn, Michigan 48128 • 313-593-5000
The University of Michigan - Ann Arbor | The University of Michigan - Flint | SITEMAP | DIRECTORY | CONTACT