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Silicon Wafer Bonding Technology for VLSI and MEMS Applications [electronic resource] / S. Iyer (ed.)
Stevenage IET 2002
book jacket
Location Call Number Status
 Electronic Book  WEB LINK    AVAIL. VIA WEB
Subject(s) Electric resistance
Grinding and polishing
Integrated circuits -- Very large scale integration
Micromechanics
Semiconductor wafers
Silicon
Silicon-on-insulator technology
Physical Description 175
Summary The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process
Series Circuits, Devices and Systems

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